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Perfluoroisobutyronitrile(C4F7N)

  • DOT Shipping Name Perfluoroisobutyronitrile, compressed
  • DOT Classification 2.2 (Non-flammable compressed gas) / 2.3 (Toxic gas)
  • DOT Label Toxic gas, Non-flammable gas
  • UN Number UN 3399
  • CAS No 425-86-5
  • Valve CGA/DISS /JIS/BS341/DIN477 CGA 660 / DISS 716
  • Shipped as Compressed Gas

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Description

C4-FN / PFIBN​ (C4-fluoronitrile, C4FN) is a perfluorinated compound developed as a high-dielectric gas for high-voltage switchgear.It has the structure (CF3)2CFC≡N, which can be described as perfluoroisobutyronitrile, falling under the category of PFAS, or per- and polyfluoroalkyl substances.
Perfluoroisobutyronitrile (i-C₄F₇N) is a high‑performance, eco‑friendly fluorinated dielectric gas. It features outstanding insulation strength (~2× SF₆), low global warming potential (GWP ≈ 2210, ~1/10 of SF₆), zero ozone depletion potential (ODP), and excellent chemical stability.
It is widely used as a leading SF₆ alternative in high‑voltage power equipment, often blended with CO₂, O₂, or N₂. It also serves as a specialty fluorochemical intermediate and process gas in advanced manufacturing.

COA

No. Properties Specifications Testing results
1 Perfluoroisobutyronitrile (i-C₄F₇N) (wt, %) ≥99.90 99.968
2 Perfluorobutyronitrile (n-C₄F₇N) (wt, %) ≤0.10 ND
3 Trifluoroacetonitrile C₂F₃N (wt, %) ≤0.002 ND
4 Hexafluoropropylene C₃F₆ (wt, %) ≤0.02 ND
5 Heptafluoropropane C₃HF₇ (wt, %) ≤0.05 0.031
6 Oxygen (vol, %) ≤0.02 0.0009
7 Nitrogen (vol, %) ≤0.08 0.0072
8 Water (wt, %) ≤0.001 0.0008
9 Acidity, Calculated by HF (wt, %) ≤0.0001 0.00007

Application

  • Power & Electrical Equipment (Primary Use)
    • Insulation and arc quenching in gas‑insulated switchgear (GIS), gas‑insulated lines (GIL), high‑voltage circuit breakers, and transformers.
    • Used in mixtures (e.g., g³ gas: C₄F₇N + CO₂ + O₂) for medium‑ to ultra‑high‑voltage systems.
    • Enables greener grid infrastructure with drastically lower greenhouse gas impact.
  • Semiconductor & Electronics Manufacturing
    • Plasma etching and chamber cleaning for advanced wafer fabrication.
    • Dielectric gas for high‑performance electronic components and sensors.
  • Aerospace & Specialty Industries
    • Dielectric insulation for high‑voltage systems in aircraft, satellites, and avionics.
    • Intermediate for synthesizing high‑performance fluoropolymers, surfactants, and specialty coatings.
  • Industrial & Specialty Chemicals
    • High‑purity process gas for fluorochemical synthesis and material surface treatment.

product description

Oxygen is a chemical element; it has symbol O and atomic number 8. It is a member of the chalcogen group in the periodic table, a highly reactive nonmetal, and an oxidizing agent that readily forms oxides with most elements as well as with other compounds. Oxygen is the most abundant element in Earth's crust, and after hydrogen and helium, it is the third-most abundant element in the universe. At standard temperature and pressure, two atoms of the element bind to form dioxygen, a colorless and odorless diatomic gas with the formula O2. Diatomic oxygen gas currently constitutes 20.95% of the Earth's atmosphere, though this has changed considerably over long periods of time. Oxygen makes up almost half of the Earth's crust in the form of oxides.

Common uses of oxygen include production of steel, plastics and textiles, brazing, welding and cutting of steels and other metals, rocket propellant, oxygen therapy, and life support systems in aircraft, submarines, spaceflight and diving.


Applications

● As a component in calibration gas .
● In first-aid treatment of emergencies such as suffocation and heart attack .
● In the treatment of patients with respiratory disorders .
● In anaesthesia .
● In chemical oxidation reaction studies .
● In semiconductor fabrication, chemical vapour deposition of silicon dioxide .
● In semiconductor fabrication, thermal oxide growth .
● In semiconductor fabrication, plasma etching .
● In semiconductor fabrication, plasma stripping of photoresist .
● In semiconductor fabrication, carrier gas in certain deposition/diffusion operations.

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