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Hexafluoroethane (C2F6)
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Contact usSpecifications
| Purity , % | 99.9 | 99.999 |
| Oxygen | ≤80 ppmv | ≤1.0 ppmv |
| Nitrogen | ≤300 ppmv | ≤4.0 ppmv |
| Carbon Dioxide | ≤50ppmv | ≤0.5ppmv |
| Carbon Monoxide | ≤30 ppmv | ≤0.5 ppmv |
| Methane | ≤30 ppmv | ≤0.5 ppmv |
| Water | ≤10 ppmv | ≤1.5 ppmv |
| CF4 | ≤100 ppmv | ≤1.0 ppmv |
| Other Organics | ≤400 ppmv | ≤2.0 ppmv |
| Acidity as HCL | ≤1.0 ppmw | ≤0.1 ppmw |
Technical Information
| Cylinder State @ 21.1°C | Liquid |
| Flammable Limits In Air | Non-flammable |
| Auto Ignition Temperature (°C ) | - |
| Molecular Weight (g/mol) | 138.01 |
| Specific gravity (air =1) | 4.82 |
| Critical Temperature ( °C ) | 19.65 |
| Critical Pressure ( psig ) | 417.5 |
description
Hexafluoroethane is the perfluorocarbon counterpart to the hydrocarbon ethane. It is a non-flammable gas negligibly soluble in water and slightly soluble in methanol. It is an extremely potent and long-lived greenhouse gas.Hexafluoroethane is used as a versatile etchant in semiconductor manufacturing. It can be used for selective etching of metal silicides and oxides versus their metal substrates and also for etching of silicon dioxide over silicon.Together with trifluoromethane it is used in refrigerants R508A (61%) and R508B (54%).It is used as a tamponade to assist in retinal reattachment following vitreoretinal surgery.
Applications
Insulation gas and plasma etching agent.
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