01
01
High Purity Chlorine Trifluoride Gas (ClF3) Fluorocarbon Gases
Why hesitate ? Inquiry us Now !
Contact usproduct description
Purity , % | 99.9 |
Oxygen | ≤20 ppmv |
Nitrogen | ≤50 ppmv |
Hydrogen Fluoride | ≤700 ppmv |
product description
Cylinder State @ 21.1°C | Liquid |
Flammable Limits In Air | Non flammable |
Auto Ignition Temperature (°C ) | - |
Molecular Weight (g/mol) | 66.007 |
Specific gravity (air =1) | 3.14 |
Critical Temperature ( °C ) | 23.85 |
Critical Pressure ( psig ) | 823.2 |
product description
Chlorine Trifluoride is a corrosive , colorless gas with a sweet odor and is highly irritating even at low concentrations . It is a powerful oxidising agent causing ignition of many organic compounds and ignites many metals at elevated temperatures . It reacts violently with water . It is shipped as a liquefied gas under its own vapour pressure . Chlorine trifluoride is an interhalogen compound with the formula ClF3. It is a colorless, poisonous, corrosive, and extremely reactive gas that condenses to a pale-greenish yellow liquid, the form in which it is most often sold (pressurized at room temperature). It is famous for its extreme oxidation properties. The compound is primarily of interest in plasmaless cleaning and etching operations in the semiconductor industry,in nuclear reactor fuel processing,historically as a component in rocket fuels, and various other industrial operations owing to its corrosive nature.
In the semiconductor industry, chlorine trifluoride is used to clean chemical vapour deposition chambers. It can be used to remove semiconductor material from the chamber walls without the need to dismantle the chamber. Unlike most of the alternative chemicals used in this role, it does not need to be activated by the use of plasma since the heat of the chamber is sufficient to make it decompose and react with the semiconductor material.ClF3 is used for the fluorination of a variety of compounds.
Applications
In the semiconductor industry, chlorine trifluoride is used to clean chemical vapour deposition chambers. It has the advantage that it can be used to remove semiconductor material from the chamber walls without having to dismantle the chamber. Unlike most of the alternative chemicals used in this role, it does not need to be activated by the use of plasma since the heat of the chamber is enough to make it decompose and react with the semiconductor material
description2